这里涵盖了几乎所有74系列芯片的Datasheet,很方便的,希望会对大家有帮助。
2021-11-01 10:02:37 14.65MB 74系列芯片Datasheet
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内涵xl7005的芯片资料 xl7005电压变换芯片 可以将48 70v的电压转换成5V
2021-10-27 14:36:45 205KB xl7005芯片
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XP06是一款集成USB Power Delivery(PD2.0/3.0)快充协议,QC3.0/2.0 快充协议,和三星AFC快充协议(兼容BC1.2)的USB多功能取电芯片,支持从手机充电器/车充等电源上取电给产品供电。
2021-10-25 21:01:52 484KB USB取电 充电器取电
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QCC5125 VFBGA is a system on-chip (SoC) with on-chip Bluetooth, audio and programmable application processor. It includes high-performance, analog, and digital audio codecs, Class-AB and Class-D audio drivers, advanced power management, Li-ion battery charger, light-emitting diode (LED) drivers, and flexible interfaces including interintegrated circuit sound (I²S), inter-integrated circuit interface (I²C), universal asynchronous receiver transmitter (UART), and programmable input/output (PIO). An application-dedicated Developer Processor and a system Firmware Processor run code from an external quad serial peripheral interface (QSPI) flash. Both processors have tightly coupled memory (TCM) and an on-chip cache for performance while executing from external flash memory. The system Firmware Processor provides functions developed by Qualcomm Technologies International, Ltd. (QTIL). The Developer processor provides flexibility to the product designer to customize their product. The Audio subsystem contains a programmable Kalimba core running Qualcomm® Kymera™ system DSP architecture framework from read only memory (ROM). A range of audio processing capabilities are provided from ROM which are configurable in fully flexible audio graphs. In built capabilities in ROM, may be complimented or replaced by capabilities run from random access memory (RAM), including those provided by QTIL, the product designer or third parties. The flexibility provided by the fully programmable applications processor plus the ability to configure and program the audio processors enables manufacturers to easily differentiate products with new features. QCC5125 VFBGA is driven by a flexible, software platform with powerful integrated development environment (IDE) support. This enables rapid time-to-market deployment for a broad range of consumer electronic products, including audio, wireless speaker, Qualcomm TrueWireless, and broadcast audio for stereo speaker arrangements.
2021-10-05 03:27:44 1.62MB 高通QCC5125资料
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洛达蓝牙芯片AB1562datasheet
2021-09-27 14:56:29 2.8MB 洛达蓝牙芯片datasheet
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RTL87xx选型手册,对比各项参数,封装,应用类型,CPU clock,SPI,flash,GPIO,等等还包括各芯片的数据手册
2021-08-27 11:12:22 4.95MB RTL87x
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mma8653芯片datasheet中文手册
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CH374芯片datasheet
2021-08-11 17:17:50 256KB CH374 spi usb
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元器件数据手册
2021-08-11 13:02:50 144.43MB 电子元器件 datasheet
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GT9110L 芯片的datasheet,可以看到该芯片支持的触摸屏尺寸和支持的分辨率及手势唤醒功能
2021-07-28 10:38:19 1.24MB 触摸屏
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