可靠性 用于可靠性分析的Python类，包括Monte Carlo和FORM方法。 显示了一些应用示例。 该项目仍在开发中。

Analog IC Reliability in Nanometer CMOS-2013 [206]

利用蒙特卡洛计算结构可靠度，文中的变量为非正态。

Authors: Dana Crowe & Alec Feinberg 1. Reliability Science 1.1 Introduction 1.2 Reliability Design: “A Stage Gate Approach” 1.3 Design for Reliability Tools 1.4 Reliability Verification 1.5 Analytical Physics 1.6 The Goal Is Customer Satisfaction 2. Understanding Customer Requirements 2.1 Introduction 2.2 Specified and Unspecified Requirements 2.3 Cost of Reliability 2.4 Benchmarking 2.5 Using Failure Modes and Effects Analysis to Meet Customer Requirements 3. Design Assessment Reliability Testing 3.1 Introduction 3.2 Four-Corner HALT Testing 3.3 Design Assessment Reliability Testing at the Hybrid and Component Level 3.4 Summary 4. Design Maturity Testing (DMT) 4.1 Introduction 4.2 Overview of DMT Planning 4.3 DMT Reliability Objectives 4.4 DMT Methods 4.5 Reliability and Sampling Distribution Models 4.6 Sample Size Planning 4.7 Automated Accelerated Test Planning 4.8 DMT Methodology and Guidelines References 5. Screening and Monotoring 5.1 Introduction 5.2 Achieving Reliability Growth in a Screening Program 5.3 Monitoring and Screening Tools 5.4 Highly Accelerated Stress Screening (HASS)Section II: Supporting Stage Gate Authors: Carl Bunis & Peter Ersland 6. Semiconductor Process Reliability 6.1 Introduction 6.2 Overview of Semiconductor Process Reliability Studies in the GaAs Industry 6.3 Wafer Level Reliability Tests 6.4 Summary References 7. Analytical Physics 7.1 Introduction 7.2 Physics of Failure 7.3 Analysis Flow 7.4 Failure Analysis Example 7.5 Analytical Techniques References Section III: Topics in Reliability Authors: Dana Crowe & Alec Feinberg 8. Reliability Statistics Simplified 8.1 Introduction 8.2 Definitions and Reliability Mathematics 8.3 Failure Rate Concepts 8.4 Reliability Models 8.5 Reliability Objectives and Confidence Testing 8.6 Parametric and Catastrophic Methods 8.7 Influence of Acceleration Factors on Test Planning References Appendix A – AT&T and Common Weibull Model Comparisons Appendix B – Helpful Microsoft® Excel Functions 9. Concepts in Accelerated Testing 9.1 Introduction 9.2 Common Sense Guidelines for Preventing Anomalous Accelerated Testing Failures 9.3 Time Acceleration Factor 9.4 Applications to Accelerated Testing 9.5 High-Temperature Operating Life Acceleration Model 9.6 Temperature-Humidity-Bias Acceleration Model 9.7 Temperature Cycle Acceleration Model 9.8 Vibration Acceleration Model 9.9 Electromigration Acceleration Model 9.10 Failure-Free Accelerated Test Planning 9.11 Step-Stress Testing 9.12 Describing Life Distributions as a Function of Stress 9.13 Summary References10. Accelerated Reliability Growth 10.1 Introduction 10.2 Estimating Benefits with Reliability Growth Fixes 10.3 Accelerated Reliability Growth Methodology 10.4 Applying Accelerated Reliability Growth Theory 10.5 Assessing Reliability Growth 10.6 Summary References Appendix – Accelerated Reliability Growth Stage Gate Model 11. Reliability Predictive Modeling 11.1 Introduction 11.2 System Reliability Modeling 11.3 Customer Expectations 11.4 Various Methods 11.5 Common Problems References Appendix A – Tabulated k of n System Effective Failure Rates Appendix B – Redundancy Equation with and without Repair Appendix C – Availability 12. Failure Modes and Effects Analysis 12.1 Failure Modes and Effects Analysis 12.2 FMEA Goal and Vision 12.3 FMEA Concepts 12.4 Types of FMEA Evaluations 12.5 Objectives 12.6 An FMEA Example 12.7 Implementation Methods Appendix A – Guide to Assigning FMEA Key Criteria Appendix B – FMEA Forms 13. Evaluating Product Risk 13.1 Introduction 13.2 Goals of a Risk Program 13.3 Managing Risks for Your Program 13.4 Four Steps to Risk Management 13.5 Guidelines for Risk Planning (Step 1) 13.6 Guidelines for Risk Assessment (Step 2) 13.7 Guidelines for Risk Analysis (Step 3) 13.8 Guidelines for Risk Handling (Step 4) 14. Thermodynamic Reliability Engineering 14.1 Thermodynamics and Reliability Engineering 14.2 The System and Its Environment 14.3 The Aging Process 14.4 Aging Due to Cyclic Force 14.5 Corrosion and Activation 14.6 Diffusion 14.7 Transistor Aging of Key Device Parameters 14.8 Understanding Logarithmic-in-Time Parametric Aging Associated with Activated Processes 14.9 Summary References

在新一代的集成模块化航空电子系统中，机载软件采用开放的分布式架构，其中模块共享各种公共资源，并且彼此之间进行复杂的交互，从而导致模块故障易于传播，因此可靠性高。机载软件可能会减少。 机载软件的分析，测量和改进已成为需要解决的重要问题。 针对机载分布式软件的特点，提出了一种基于AADL的误差建模和可靠性分析方法。 利用AADL体系结构模型中的关键信息，可以生成AADL错误模型来描述机载分布式软件的故障行为。 在此步骤的基础上，使用灵敏度分析方法来分析系统可靠性。 因此，设计人员可以在开发的早期阶段找到影响系统可靠性的关键模块，从而在决策的基础上提高系统的可靠性。

涵盖了实践中软件可靠性工程技术的制定，应用和评估。

欧洲航天局 ECSS-Q-ST-70-38C High-reliability soldering for surface-mount and mixed technology 2018

Statistics and Physics in Reliability.

RELIABILITY and QUALITY MANAGEMENT

Practical_Reliability_Engineering_Ebook fifth edition 第五版 英文版