印刷电路板手册第六版
Part 1 Lead-Free Legislation
Chapter 1. Legislation and Impact on Printed Circuits 1.3
1.1 Legislation Overview / 1.3
1.2 Waste Electrical and Electronic Equipment (WEEE) / 1.3
1.3 Restriction of Hazardous Substances (RoHS) / 1.3
1.4 RoHS’ Impact on the Printed Circuit Industry / 1.6
1.5 Lead-Free perspecives / 1.10
1.6 Other Legislative Initiatives / 1.10
Part 2 Printed Circuit Technology Drivers
Chapter 2. ELECTRONIC PACKAGING AND HIGH-DENSITY
INTERCONNECTIVITY 2.3
2.1 Introduction / 2.3
2.2 Measuring the Interconnectivity Revolution (HDI) / 2.3
2.3 Hierarchy of Interconnections / 2.6
2.4 Factors Affecting Selection of Interconnections / 2.7
2.5 ICS and Packages / 2.10
2.6 Density Evaluations / 2.14
2.7 Methods to Increase PWB Density / 2.16
References / 2.21
Chapter 3. Semiconductor Packaging Technology 3.1
3.1 Introduction / 3.1
3.2 Single-Chip Packaging / 3.5
3.3 Multichip Packages / 3.15
3.4 Optical Interconnects / 3.18
3.5 High-Density/High-Performance Packaging Summary / 3.21
3.6 Roadmap Information / 3.21
References / 3.21
Chapter 4. Advanced Component Packaging 4.1
4.1 Introduction / 4.1
4.2 Lead-Free / 4.2
4.3 System-on-a-Chip (SOC) versus System-on-a-Package (SOP) / 4.3
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4.4 Multichip Modules / 4.5
4.5 Multichip Packaging / 4.6
4.6 Enabling Technologies / 4.10
4.7 Acknowledgment / 4.18
References / 4.18
Chapter 5. Types of Printed Wiring Boards 5.1
5.1 Introduction / 5.1
5.2 Classification of Printed Wiring Boards / 5.1
5.3 Organic and Nonorganic Substrates / 5.3
5.4 Graphical and Discrete-Wire Boards / 5.3
5.5 Rigid and Flexible Boards / 5.5
5.6 Graphically Produced Boards / 5.6
5.7 Molded Interconnection Devices / 5.10
5.8 Plated-Through-Hole (PTH) Technologies / 5.10
5.9 Summary / 5.13
References / 5.14
Part 3 Materials
Chapter 6. Introduction to Base Materials 6.3
6.1 Introduction / 6.1
6.2 Grades and Specifications / 6.3
6.3 Properties Used to Classify Base Materials / 6.9
6.4 Types of F
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