This method establishes a standard procedure for testing and classifying microcircuits according to their
susceptibility to damage or degradation by exposure to a defined electrostatic Human Body Model
(HBM) discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that
accurate classifications can be performed.
2023-07-18 17:36:02
281KB
1
JESD22-B117A 2006 SOLDER BALL SHEAR BGA焊球剪切测试
JEDEC标准，由固态技术协会编制、评审，该标准国际通用，相信对集成电路行业质量管理人员和测试人员有一定帮助。
2023-03-08 16:50:05
234KB
1
JESD22-A101C [Steady-State Temperature Humidity Bias Life Test]
2022-07-15 13:43:05
181KB
1
半导体行业，塑封密封性质量的国际通用测试方法。
2022-06-27 17:32:17
32KB
1
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. free for $54
2022-04-16 09:00:08
117KB
1